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Inspur NF5280G7 NF5280-M7-A0-F0-00 Rack Server

Equipped with the 4th/5th Gen Intel Xeon Scalable processors, supports up to 64 cores and 128 threads per CPU with up to 350W TDP and a max turbo frequency of 4.2 GHz through 4 UPI links at 20 GT/s.

SKU: NF5280-M7-A0-F0-00 Category: Brand:
Product SKU

NF5280-M7-A0-F0-00

Form Factor

2U rack server

Processor

– Up to one or two 4th/5th Gen Intel Xeon Scalable processors
– Up to 64 cores, with a max Turbo frequency of 4.2GHz
– 4 UPI links per CPU and up to 20 GT/s per link
– Up to 350W TDP

Chipset

Intel Emmitsburg

Memory

– Up to 32 DDR5 DIMMs (5,600 MT/s)
– 16 DIMMs per CPU and 32 DIMMs for 2 CPUs
– RDIMMs supported

Storage

General
– 12 × 3.5-inch SAS/SATA/NVMe drives
– 24 × 2.5-inch SAS/SATA/NVMe drives
– 25 × 2.5-inch SAS/SATA drives (up to 4 × NVMe) 24 × E3.S SSDs
– 9 × 3.5-inch SAS/SATA drives (up to 2 × NVMe)
– 8/16 × 2.5-inch SAS/SATA/NVMe drives
– Up to 3 × TF cards (1 for BMC, and 2 for PCH) Up to 2 × SATA M.2 SSDs or 2 × PCIe x4 M.2 SSDs Up to 4 × 3.5-inch SAS/SATA drives or up to 10 × 2.5-inch SAS/SATA drives
– Up to 3 × TF cards (1 for BMC, and 2 for PCH)
– Up to 2 × SATA M.2 SSDs or 2 × PCIe x4 M.2 SSDs

Storage Controller

– RAID/SAS controller
– Onboard PCH that supports 14 SATA connectors
– Intel onboard NVMe controller and optional Intel NVMe RAID Key

Network

– 2 × optional hot-swappable OCP 3.0
– 3 × optional hot-swappable OCP 3.0

I/O Expansion

– Up to 16 PCIe expansion slots, including 1 RAID Mezz slot and 2 hot-swappable OCP 3.0 slots
– Liquid cooling supports up to 9 PCIe expansion slots, including 2 hot-swappable OCP 3.0
– Up to 20 PCIe expansion slots, including 1 RAID Mezz slot and 3 hot-swappable OCP 3.0 slots (1 for the front, 2 for the rear)

Ports and Interfaces

– Front: 1 × USB 2.0 port, 1 × USB 3.0 port, 1 × DB15 VGA port, 1 × USB type-C port
– Front: 1 × USB 2.0 port, 1 × USB 3.0 port, 1 × RJ45 port, 1 × DB15 VGA port
– Rear: 2 × USB 3.0 ports, 1 × DB15 VGA port, 1 × Micro USB system serial port, 1 × RJ45 port
– Internal: 1 × USB 3.0 port

Power Supply

Supports 800W/1,300W/1,600W/2,000W/2,700W CRPS standard PSUs with 1+1 redundancy

Cooling

6 hot-swappable N+1 redundant dual-rotor fans

System Management

Integrated with 1 independent 1,000 Mbps network port, dedicated to IPMI remote management

Security

Two-factor authentication, TPM 2.0, security panel, intrusion alert, BMC/BIOS chip-level redundancy, power capping, etc.

Operating System

Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, etc.

Dimensions

– With mounting ears: 482.4mm × 87mm × 828.4mm
– Without mounting ears: 435mm × 87mm× 800mm

Weight

Full configuration: ≤33 kg (For details, please refer to the White Paper)

Operating Temperature

5°C to 50°C (For details, please refer to the White Paper)

Overview

Equipped with the 4th/5th Gen Intel Xeon Scalable processors, supports up to 64 cores and 128 threads per CPU with up to 350W TDP and a max turbo frequency of 4.2 GHz through 4 UPI links at 20 GT/s. Supports up to 32 DDR5 ECC DIMMs (5,600 MT/s, RDIMMs) in delivering high speeds and superior availability.

Key Features

  • Excellent Performance and Efficient Computing: Equipped with the 4th/5th Gen Intel Xeon Scalable processors, supports up to 60->64 cores and 120->128 threads per CPU with up to 350W TDP and a max Turbo frequency of 4.2 GHz through 4 UPI links at 20 GT/s.Supports up to 32 DDR5 ECC DIMMs (5,600 MT/s, RDIMMs) in delivering high speeds and superior availability.
  • Break-thru Design and Full-scenario Adaptability: Offers ultimate computing, storage and network performance, and delivers flexible combination through modular design to support 45 × 2.5-inch drive or 20 × 3.5-inch drive and the optional rear M.2/E1.S SSD for diverse storage demands, and to support PCIe 5.0/4.0 for different scalability requirements, with up to 20 PCIe expansions.Supports up to 2 to 3 optional hot-swappable OCP 3.0 modules, and provides 1Gb, 10Gb, 25Gb, 40Gb, 100Gb, 200Gb, and 400Gb network interfaces.With Compute Express Link (CXL), an open-source and standard cache-coherent interconnect protocol, and E3.S storage medium, provides caching media apart from traditional DIMMs to meet the core needs of large-capacity cache…
  • Flexible Architecture and Security & Intelligence: The front I/O design enables O&M engineer to operate in the cold aisle, which simplifies O&M procedures, prolongs the service lifecycle of thermo-sensitive components such as optical modules and smart NICs, and improves data stability.The redundancy design of core components, such as the BIOS and BMC, ensures that the system can start by switching to the standby chip, and supports the online upgrade of the BMC without suspending services, thus guaranteeing service continuity.Adhering to the intelligent O&M, the cloud-based O&M and the online diagnosis can greatly simplify the difficulty in data center O&M and lower the O&M cost.
  • High Efficiency, Carbon Emission Reduction, and Low Power Consumption: Supports efficient heat dissipation schemes such as cold-plated cooling and EVAC, and provides the data centers with the comprehensive liquid-cooling solutions.By working with unique intelligent zone-oriented control technology, delivers energy-saving fan speed regulation and accurate air supply according to recent regional workload changes.With the focus on environmental protection, key server components meet the lead-free requirements (RoHS), and all packaging materials are recyclable.

Configuration, availability and lead time depend on the required quantity, system pairing and delivery destination. Send your requirement to receive a quotation.

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