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Lenovo ThinkSystem SR860 V3

The Lenovo ThinkSystem SR860 V3 is a 4U rack server from Lenovo, powered by 4th Gen Intel Xeon Scalable processors, either Gold or Platinum level processors, with up to 48x 2.5-inch hot-swap drive bays.

SKU: SR860-V3 Category: Brand:
Product SKU

SR860 V3

Form Factor

4U rack

Processor

Two or four 4th Gen Intel Xeon Scalable processors, either Gold or Platinum level processors (formerly codename "Sapphire Rapids" or SPR). Supports processors up to 60 cores, core speeds up to 3.7 GHz, and TDP ratings up to 350W. Three Intel Ultra Path Interconnect (UPI) links at 16 GT/s each. Four processors are connected in a mesh topology. Support for up to four Intel embedded accelrators: QAT, DLB, IAA, and DSA.

GPU Support

Supports up to 8x single-wide GPUs or up to 4x double-wide GPUs

Memory

Up to 64 DIMM slots (16 DIMMs per processor). Each processor has 8 memory channels, with 2 DIMMs per channel. Lenovo TruDDR5 RDIMMs and 3DS RDIMMs are supported. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 4800 MHz at 1 DPC and 4400 MHz at 2 DPC.

Drive Bays

Up to 48x 2.5-inch hot-swap drive bays:
• Up to 48x SAS/SATA drive bays
• Up to 24x SAS/SATA + 24x AnyBay drive bays (support SAS, SATA, Gen4 NVMe, or Gen5 NVMe drives)
Optional two 7mm hot-swap SSD drive bays at the rear of the server, either SATA or NVMe, for OS boot or storage

Expansion Slots

Up to 18 PCIe slots (Gen4 only or Gen5+Gen4), depending on the configuration, plus two Gen5 OCP 3.0 slots. Slot combinations are based on the risers selected:
• 18x Gen4 PCIe slots
• 12x Gen5 PCIe slots + 4x Gen4 PCIe slots
• 4x Gen4 PCIe slots (entry configuration)

Chipset

Intel C741 "Emmitsburg" chipset, part of the platform codenamed "Eagle Stream" (EGS)

Persistent Memory

No support. Supports up to 32x Intel Optane Persistent Memory 300 Series modules installed in the DIMM slots. Persistent memory is installed in combination with system memory DIMMs. Supports App Direct mode to enhance the performance of applications such as SAP HANA.

Maximum Memory

With system memory DIMMs: Up to 16TB with 64x 256GB 3DS RDIMMs and four processors (4.0TB per processor).
With Persistent Memory in AppDirect mode: Up to 24TB total memory (16TB of Persistent Memory using 32x 512GB PMem modules + 8TB of system memory using 32x 256GB 3DS RDIMMs and four processors) (6TB per processor)

Memory Protection

ECC, SDDC (for 10×4-based memory DIMMs), ADDDC (for 10×4-based memory DIMMs), memory mirroring.

Maximum Internal Storage

1474.56TB using 48x 30.72TB 2.5-inch SAS/SATA SSDs
1474.56TB using 24x 61.44TB 2.5-inch NVMe SSDs
115.2TB using 48x 2.4TB 2.5-inch HDDs
Mix of NVMe/SSDs/HDDs supported.

Storage Controller

• Up to 24x Onboard PCIe Gen 5 or Gen 4 NVMe ports (RAID functions provided using Intel VROC)
• 12 Gb SAS/SATA RAID adapters
• 12 Gb SAS/SATA HBA (non-RAID)

Network

Two dedicated OCP 3.0 SFF slots with PCIe 5.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with network connectivity up to 100 GbE. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support.

Ports

Front: One VGA video port. 1x USB 3.2 G1 (5 Gb/s) port, 1x USB 2.0 port. The USB 2.0 port can be configured to support local systems management by using the XClarity mobile app on a mobile device connected via a USB cable.
Rear: Three USB 3.2 G1 (5 Gbp/s) ports, one VGA video port, one DB-9 serial port, and one RJ-45 XClarity Controller (XCC) systems management port. The serial port can be shared with the XCC for serial redirection functions.
Internal: Optional M.2 adapter in dedicated slot supporting one or two M.2 drives (for OS boot support, including hypervisor support).

Cooling

12x N+1 redundant hot-swap 60 mm fans (all 12 standard). One additional fan integrated in each of the four power supplies.

Power Supply

Up to four hot-swap redundant AC power supplies (80 PLUS Platinum or Titanium certification): 1100W to 2600W options, supporting 220 V AC. 1100 W options also support 110V input supply. For China only, supports 1300 W and 2600 W 240V AC/DC Platinum CRPS, or 1600 W 336V DC or -48V DC CRPS. Power supplies can be configured as N+N redundant.

System Management

Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. Models with 16x 2.5-inch front drive bays can optionally support an Integrated Diagnostics Panel. XClarity Controller 2 (XCC2) embedded management based on the ASPEED AST2600 baseboard management controller (BMC). Dedicated rear Ethernet port for XCC2 remote access for management. XClarity One for centralized infrastructure management, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. XCC2 Platinum is included which enables remote control functions and other features.

Security

Chassis intrusion switch, Power-on password, administrator's password, Root of Trust module supporting TPM 2.0 and Platform Firmware Resiliency (PFR).

Operating System

Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi.

Warranty

3-year or 1-year (model dependent) customer-replaceable unit and onsite limited warranty with 9×5 next business day (NBD).

Dimensions (H x W x D)

Width: 447 mm (17.6 in.), height: 175 mm (6.9 in.), depth: 906 mm (35.7 in.). See Physical and electrical specifications for details.

Weight

Maximum: 59.4 kg (131 lb)

Overview

The Lenovo ThinkSystem SR860 V3 is a 4U rack server from Lenovo, powered by 4th Gen Intel Xeon Scalable processors, either Gold or Platinum level processors.

It supports up to 64 DIMM slots. Maximum memory reaches up to 16TB with 64x 256GB 3DS RDIMMs and four processors (4.0TB per processor). Storage is provided by up to 48x 2.5-inch hot-swap drive bays. Expansion is provided by up to 18 PCIe slots. Networking is provided by Two dedicated OCP 3.0 SFF slots with PCIe 5.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with network.

Key Features

  • Processor: Two or four 4th Gen Intel Xeon Scalable processors, either Gold or Platinum level processors (formerly codename “Sapphire Rapids” or SPR). Supports processors up to 60 cores, core speeds up to 3.7 GHz, and TDP ratings up to 350W. Three Intel Ultra Path Interconnect (UPI) links at 16 GT/s each. Four …
  • Memory: Up to 64 DIMM slots (16 DIMMs per processor). Each processor has 8 memory channels, with 2 DIMMs per channel. Lenovo TruDDR5 RDIMMs and 3DS RDIMMs are supported. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 4800 MHz at 1 DPC and 4400 MHz at 2 …
  • Maximum memory: With system memory DIMMs: Up to 16TB with 64x 256GB 3DS RDIMMs and four processors (4.0TB per processor). …
  • Storage: Up to 48x 2.5-inch hot-swap drive bays: / Up to 48x SAS/SATA drive bays / Up to 24x SAS/SATA + 24x AnyBay drive bays (support SAS, SATA, Gen4 NVMe, or Gen5 NVMe drives) …
  • Maximum internal storage: 1474.56TB using 48x 30.72TB 2.5-inch SAS/SATA SSDs / 1474.56TB using 24x 61.44TB 2.5-inch NVMe SSDs / 115.2TB using 48x 2.4TB 2.5-inch HDDs …
  • Expansion: Up to 18 PCIe slots (Gen4 only or Gen5+Gen4), depending on the configuration, plus two Gen5 OCP 3.0 slots. Slot combinations are based on the risers selected: / 18x Gen4 PCIe slots / 12x Gen5 PCIe slots + 4x Gen4 PCIe slots …
  • GPU support: Supports up to 8x single-wide GPUs or up to 4x double-wide GPUs
  • Networking: Two dedicated OCP 3.0 SFF slots with PCIe 5.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with network connectivity up to 100 GbE. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support.
  • Cooling and power: 12x N+1 redundant hot-swap 60 mm fans (all 12 standard). One additional fan integrated in each of the four power supplies. Up to four hot-swap redundant AC power supplies (80 PLUS Platinum or Titanium certification): 1100W to 2600W options, supporting 220 V AC. 1100 W options also support 110V …
  • Management and security: Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. Models with 16x 2.5-inch front drive bays can optionally support an Integrated Diagnostics Panel. XClarity Controller 2 (XCC2) embedded management based on the ASPEED AST2600 baseboard management controller …
  • Physical: Width: 447 mm (17.6 in.), height: 175 mm (6.9 in.), depth: 906 mm (35.7 in.). See Physical and electrical specifications for details. Maximum: 59.4 kg (131 lb)

Applications

  • Enterprise virtualization and private cloud
  • Databases and business-critical applications
  • AI inference and high-performance computing
  • Software-defined storage and data analytics

Configuration, availability and lead time depend on the required quantity, chassis and CPU platform, and delivery destination. Send your requirement to receive a quotation.

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