Lenovo ThinkSystem SR860 V4 Server

Description

Product overview

The Lenovo ThinkSystem SR860 V4 is a 4-socket large-memory server in a 4U rack design. The server offers technology advances, including Intel Xeon 6700-Series processors, up to 16 TB of 6400 MHz DDR5 memory, and up to 18x PCIe slots for adapters. This product guide provides essential pre-sales information to understand the ThinkSystem SR860 V4 server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SR860 V4 and consider its use in IT solutions.

Key capabilities

Machine types: 7DJQ – 1 year warranty; 7DJN – 3 year warranty; 7DJR – 3 year warranty – SR860 V4 with SAP HANA
Form factor: 4U rack
Processor: Two or four Intel Xeon 6700P-series processors (formerly codenamed "Granite Rapids SP"). Supports processors up to 86 cores and 172 threads, core speeds of up to 4.0 GHz, and TDP ratings of up to 350 W.
Chipset: None. Integrated into the processor
Memory: 64 DIMM slots with four processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR5 RDIMMs and 3DS RDIMMs are supported. RDIMMs operate at up to 6400 MHz at 1 DPC and up to 5200 MHz at 2 DPC. Up to 16x CXL 2.0 memory modules are also supported, installed in the front E3.S 2T drive bays (4 processors required)

Technical specifications

Machine types	7DJQ – 1 year warranty; 7DJN – 3 year warranty; 7DJR – 3 year warranty – SR860 V4 with SAP HANA
Form factor	4U rack
Processor	Two or four Intel Xeon 6700P-series processors (formerly codenamed "Granite Rapids SP"). Supports processors up to 86 cores and 172 threads, core speeds of up to 4.0 GHz, and TDP ratings of up to 350 W.
Chipset	None. Integrated into the processor
Memory	64 DIMM slots with four processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR5 RDIMMs and 3DS RDIMMs are supported. RDIMMs operate at up to 6400 MHz at 1 DPC and up to 5200 MHz at 2 DPC. Up to 16x CXL 2.0 memory modules are also supported, installed in the front E3.S 2T drive bays (4 processors required)
Memory maximum	Up to 16TB by using 64x 256GB 3DS RDIMMs
Memory protection	ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs), and memory mirroring.
Disk drive bays	Three drive bay configuration choices:; Up to 48x 2.5-inch hot-swap drives: All SAS/SATA; 24x AnyBay + 24x SAS/SATA; Up to 32x E3.S 1T NVMe hot-swap + 24x 2.5-inch SAS/SATA hot-swap drive bays; Up to 16 E3.S 2T bays for CXL memory + 24x 2.5-inch SAS/SATA hot-swap drive bays; M.2 support, for OS boot and drive storage support:; 2x rear hot-swap M.2 drive bays (configurations with full-height slots only), or; Internal M.2 module supporting up to two M.2 drives; See Storage configurations for details.
Maximum internal storage	2.5-inch drives: 1474.56TB using 48x 30.72TB 2.5-inch SAS SSDs; 368.64TB using 48x 7.68TB 2.5-inch SATA SSDs; 368.64TB using 24x 15.36TB 2.5-inch NVMe SSDs; 115.2TB using 48x 2.4TB 2.5-inch SAS HDDs; EDSFF drives 1966.08TB using 32x 61.44TB E3.S EDSFF NVMe SSDs
Storage controllers	Onboard NVMe ports with optional RAID support using Intel VROC; NVMe RAID support using a Tri-mode RAID adapter; 12 Gb SAS/SATA RAID adapters, PCIe 4.0 or PCIe 3.0 host interface; 12 Gb SAS/SATA HBA (non-RAID), PCIe 4.0 or PCIe 3.0 host interface
Optical drive bays	No internal optical drive.
Tape drive bays	No internal backup drive.

Configuration note

Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.