Supermicro SYS-531MC-H8TNR 3U MicroCloud Server

3U 8-Node MicroCloud with single-width GPU support

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Description

Product overview

3U 8-Node MicroCloud with single-width GPU support

Key capabilities

  • Form Factor: 3U Rackmount Enclosure: 438 x 132 x 589mm (17.26" x 5.21" x 23.2") Package: 667 x 295.91 x 863.6mm (26.26" x 11.65" x 34")
  • Processor: Single Socket LGA-1700 (Socket V0) supported, CPU TDP supports Up to 95W TDP; Intel® C266; 8 set of Up to 128GB ECC UDIMM; DDR5 4400MHz, in 4 DIMM sockets; 8 set of PCIe 5.0 x8 (in x16 slot) low profile slot and 8 set of PCIe 4.0 x8 Micro- LP slots; 8 set of 2x Front Hot-swappable 3.5" SATA3 HDD or Hybrid 2x 2.5" SAS/SATA3/NVMe U.2 drives w/ option kits; 2200W Redundant Titanium Level high-efficiency power supplies; Form Factor 3U Rackmount Enclosure: 438 x 132 x 589mm (17.26" x 5.21" x 23.2") Package: 667 x 295.91 x 863.6mm (26.26" x 11.65" x 34") Processor Single V0 (LGA-1700) Intel® Xeon® 6300-series/E-2400/Pentium® G7400/G7400T processors GPU Up to 1 single-width GPU
  • System Memory: Slot Count: 4 DIMM slots Max Memory (2DPC): Up to 128GB 4400MT/s ECC DDR5 UDIMM
  • Drive Bays Configuration: Default: Total 2 bays 2 front hot-swap 3.5" NVMe/SAS/SATA drive bays M.2: 2 M.2 NVMe/SATA slots (M-key 2280/22110)
  • Expansion Slots: Default 1 PCIe 5.0 x8 (in x16) LP slot 1 PCIe 4.0 x8 (in x8) MicroLP slot

Technical specifications

Form Factor 3U Rackmount Enclosure: 438 x 132 x 589mm (17.26" x 5.21" x 23.2") Package: 667 x 295.91 x 863.6mm (26.26" x 11.65" x 34")
Processor Single Socket LGA-1700 (Socket V0) supported, CPU TDP supports Up to 95W TDP; Intel® C266; 8 set of Up to 128GB ECC UDIMM; DDR5 4400MHz, in 4 DIMM sockets; 8 set of PCIe 5.0 x8 (in x16 slot) low profile slot and 8 set of PCIe 4.0 x8 Micro- LP slots; 8 set of 2x Front Hot-swappable 3.5" SATA3 HDD or Hybrid 2x 2.5" SAS/SATA3/NVMe U.2 drives w/ option kits; 2200W Redundant Titanium Level high-efficiency power supplies; Form Factor 3U Rackmount Enclosure: 438 x 132 x 589mm (17.26" x 5.21" x 23.2") Package: 667 x 295.91 x 863.6mm (26.26" x 11.65" x 34") Processor Single V0 (LGA-1700) Intel® Xeon® 6300-series/E-2400/Pentium® G7400/G7400T processors GPU Up to 1 single-width GPU
System Memory Slot Count: 4 DIMM slots Max Memory (2DPC): Up to 128GB 4400MT/s ECC DDR5 UDIMM
Drive Bays Configuration Default: Total 2 bays 2 front hot-swap 3.5" NVMe/SAS/SATA drive bays M.2: 2 M.2 NVMe/SATA slots (M-key 2280/22110)
Expansion Slots Default 1 PCIe 5.0 x8 (in x16) LP slot 1 PCIe 4.0 x8 (in x8) MicroLP slot
On-Board Devices SATA: SATA (6Gbps); RAID 0/1 support Network Connectivity: No NIC option supported
Input / Output USB: 1 Type-C port (front) 2 USB 2.0 Type-A ports Video: 1 port TPM: 1 TPM Onboard/port 80
System Cooling Fans: Up to 4 Heavy Duty 8cm Fan(s) Air Shroud: 8 Air Shrouds
Power Supply 2x 2200W Redundant (1 + 1) Titanium Level (96%) power supplies
System BIOS BIOS Type: AMI 256MB SPI Flash EEPROM
Management SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: 3-Phase-switching voltage regulator with auto-sense from 0.5V-2.3V Monitors for CPU Cores, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages. Fan: Fan speed control, Dual Cooling Zone Temperature: Monitoring for CPU and chassis environment
Dimensions and Weight Weight: Gross Weight: 88 lbs (39.92 kg) Net Weight: 62.2 lbs (28.21 kg) Available Color: N/A
Operating Environment RoHS Compliant Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 8% to 95% (non-condensing)
Motherboard Super X13SCD-F
Chassis CSE-938NH-R2K20BP2

Configuration note

Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.

Official sources