| Product SKU | MI300X-192GB |
|---|---|
| Name | AMD Instinct™ MI300X |
| Family | Instinct |
| Series | Instinct MI300 Series |
| Form Factor | Servers |
| Launch Date | 12/06/2023 |
| GPU Architecture | CDNA3 |
| Lithography | TSMC 5nm, 6nm FinFET |
| Stream Processors | 19,456 |
| Matrix Cores | 1216 |
| Compute Units | 304 |
| Peak Engine Clock | 2100 MHz |
| Peak Eight-bit Precision (FP8) Performance (E5M2, E4M3) | 2.61 PFLOPs |
| Peak Eight-bit Precision (FP8) Performance with Structured Sparsity (E5M2, E4M3) | 5.22 PFLOPs |
| Peak Half Precision (FP16) Performance | 1.3 PFLOPs |
| Peak Half Precision (FP16) Performance with Structured Sparsity | 2.61 PFLOPs |
| Peak Single Precision (TF32 Matrix) Performance | 653.7 TFLOPs |
| Peak Single Precision (TF32) Performance with Structured Sparsity | 1.3 PFLOPs |
| Peak Single Precision Matrix (FP32) Performance | 163.4 TFLOPs |
| Peak Single Precision (FP32) Performance | 163.4 TFLOPs |
| Peak Double Precision Matrix (FP64) Performance | 163.4 TFLOPs |
| Peak Double Precision (FP64) Performance | 81.7 TFLOPs |
| Peak INT8 Performance | 2.6 POPs |
| Peak INT8 Performance with Structured Sparsity | 5.22 POPs |
| Peak bfloat16 | 1.3 PFLOPs |
| Peak bfloat16 with Strutured Sparsity | 2.61 PFLOPs |
| Transistor Count | 153 Billion |
| External Power Connectors | 54V UBB |
| Typical Board Power (TBP) | 750W Peak |
| Last Level Cache (LLC) | 256 MB |
| Dedicated Memory Size | 192 GB |
| Dedicated Memory Type | HBM3 |
| Infinity Cache | Yes |
| Memory Interface | 8192-bit |
| Memory Clock | 5.2 GHz |
| Peak Memory Bandwidth | 5.3 TB/s |
| Memory ECC Support | Yes (Full-Chip) |
| GPU Form Factor | OAM Module |
| Bus Type | PCIe® 5.0 x16 |
| Infinity Fabric™ Links | 8 |
| Peak Infinity Fabric™ Link Bandwidth | 128 GB/s |
| Cooling | Passive OAM |
| Supported Technologies | AMD CDNA™ 3 Architecture , AMD ROCm™ – Ecosystem without Borders , AMD Infinity Architecture |
| RAS Support | Yes |
| Page Retirement | Yes |
| Page Avoidance | Yes |
| SR-IOV | Yes |
GPU
AMD Instinct MI300X 192GB
The AMD Instinct MI300X 192GB is a data-center accelerator built on the CDNA3 architecture, with 192 GB HBM3 of memory and 5.3 TB/s of memory bandwidth. It combines 2.61 PFLOPs FP8 and 1.3 PFLOPs FP16 Tensor Core performance with a board power of 750 W peak in a Servers form factor.
Overview
The AMD Instinct MI300X 192GB is a data-center accelerator built on the AMD CDNA 3 architecture with 192 GB of HBM3 memory and a peak memory bandwidth of 5.3 TB/s. It combines 304 compute units and 1,216 matrix cores with 2.61 PFLOPs of FP8 and 1.3 PFLOPs of FP16 performance (5.22 PFLOPs and 2.61 PFLOPs with structured sparsity) in a 750 W OAM module, aimed at large-model training and inference on the ROCm stack.
At a glance
- Architecture: AMD CDNA 3; series: Instinct MI300 Series
- Memory: 192 GB HBM3, 5.3 TB/s peak bandwidth, 8192-bit interface, full-chip ECC; 256 MB last-level cache
- Compute: 304 compute units, 19,456 stream processors, 1,216 matrix cores
- Peak performance: FP8 2.61 PFLOPs (5.22 sparse), FP16/BF16 1.3 PFLOPs (2.61 sparse), FP64 81.7 TFLOPs
- Form factor: passive OAM module; board power 750 W peak; 54 V UBB power
- Bus: PCIe 5.0 x16; 8x Infinity Fabric links (128 GB/s each)
- Software: AMD ROCm; PCIe SR-IOV; RAS with page retirement and page avoidance
When to choose the MI300X
The MI300X is the fit when a large, high-bandwidth HBM3 pool per accelerator is required for very large models — 192 GB at 5.3 TB/s — in an open ROCm environment, at a 750 W board power that is easier to cool than higher-TBP modules. Its 8 Infinity Fabric links support tightly coupled multi-GPU training and inference nodes.
Platform & compatibility
The MI300X is a passive OAM module powered over 54 V UBB and is integrated into OEM accelerator platforms, not installed as a PCIe add-in card; PCIe 5.0 x16 is the host interface. It is programmed through AMD ROCm and supports PCIe SR-IOV plus RAS features including page retirement and page avoidance.
FAQ
How much memory does it have? 192 GB of HBM3 with 5.3 TB/s of bandwidth and full-chip ECC.
How does it compare to the MI325X? The MI325X offers 256 GB of HBM3E at 6 TB/s and a higher 1,000 W TBP; the MI300X offers 192 GB of HBM3 at 5.3 TB/s within 750 W.
Is it a PCIe card? No — it is a passive OAM module for OEM servers, with a PCIe 5.0 x16 host bus.
Related
- All AMD Instinct accelerators
- Data-center GPU buying guide: A100 to B300
- Browse all GPUs and accelerators
Configuration, availability and lead time depend on the required quantity, server pairing and delivery destination. Send your requirement to receive a quotation.
