Supermicro SSG-540P-E1CTR45L 4U UP Storage Server
4U UP top-loading storage server with 45 hot-swap 3.5″ SAS/SATA bays and PCIe 4.0
Description
Product overview
4U UP top-loading storage server with 45 hot-swap 3.5" SAS/SATA bays and PCIe 4.0
Key capabilities
- Form Factor: 4U Rackmount Enclosure: 437 x 178 x 660mm (17.2" x 7" x 30.2") Package: 711 x 559 x 1067mm (28" x 22" x 42")
- Processor: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 40C/80T; Up to 60MB Cache
- System Memory: Slot Count: 8 DIMM slots Max Memory (2DPC): Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Supports Intel® Optane™ persistent memory 200 series
- Drive Bays Configuration: Default: Total 47 bays 45 top-loading hot-swap 3.5" SAS/SATA drive bays 2 rear hot-swap 2.5" SATA drive bays
- Expansion Slots: Default 2 PCIe 4.0 x8 LP slots 2 PCIe 4.0 x16 LP slots
Technical specifications
| Form Factor | 4U Rackmount Enclosure: 437 x 178 x 660mm (17.2" x 7" x 30.2") Package: 711 x 559 x 1067mm (28" x 22" x 42") |
|---|---|
| Processor | Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 40C/80T; Up to 60MB Cache |
| System Memory | Slot Count: 8 DIMM slots Max Memory (2DPC): Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Supports Intel® Optane™ persistent memory 200 series |
| Drive Bays Configuration | Default: Total 47 bays 45 top-loading hot-swap 3.5" SAS/SATA drive bays 2 rear hot-swap 2.5" SATA drive bays |
| Expansion Slots | Default 2 PCIe 4.0 x8 LP slots 2 PCIe 4.0 x16 LP slots |
| On-Board Devices | SATA: SATA (6Gbps) SAS: SAS (12Gbps); (IT mode) NVMe: NVMe; RAID 0/1 support(Intel® VROC RAID key required) Network Connectivity: 2 RJ45 10GBASE-T with Intel® X550 |
| Input / Output | LAN: 1 RJ45 1 GbE Dedicated BMC LAN port 2 RJ45 10 GbE LAN ports (Intel® X550) USB: 2 USB 2.0 ports (header) 2 USB 2.0 ports (rear) 1 Type-A port 2 ports (header) 2 ports (rear) Video: 1 VGA port DOM: 2 SuperDOM (Disk on Module) portswith built-in power |
| System Cooling | Fans: Up to 5 Heavy Duty PWM 80x80x38mm Fan(s) Air Shroud: 1 Air Shroud |
| Power Supply | ; Form Factor 4U Rackmount Enclosure: 437 x 178 x 660mm (17.2" x 7" x 30.2") Package: 711 x 559 x 1067mm (28" x 22" x 42") Processor Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 40C/80T; Up to 60MB Cache System Memory Slot Count: 8 DIMM slots Max Memory (2DPC): Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Supports Intel® Optane™ persistent memory 200 series Drive Bays Configuration Default: Total 47 bays 45 top-loading hot-swap 3.5" SAS/SATA drive bays 2 rear hot-swap 2.5" SATA drive bays Expansion Slots Default 2 PCIe 4.0 x8 LP slots 2 PCIe 4.0 x16 LP slots On-Board Devices SATA: SATA (6Gbps) SAS: SAS (12Gbps); (IT mode) NVMe: NVMe; RAID 0/1 support(Intel® VROC RAID key required) Network Connectivity: 2 RJ45 10… |
| System BIOS | BIOS Type: AMI 32MB SPI Flash EEPROM |
| Management | SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: 7+1 Phase-switching voltage regulator module (VRM) Monitors for CPU Cores, Chipset Voltages, Memory Fan: Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Dimensions and Weight | Weight: Gross Weight: 120 lbs (54.43 kg) Net Weight: 100 lbs (45.36 kg) Available Color: Black |
| Operating Environment | Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Motherboard | Super X12SPi-TF |
| Chassis | CSE-946LTS-R1K66P1 |
Configuration note
Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.




