Supermicro SYS-120TP-DTTR 1U Twin Server
1U 2-node TwinPro with 4 2.5″ SATA drives per node
Description
Product overview
1U 2-node TwinPro with 4 2.5" SATA drives per node
Key capabilities
- Form Factor: 1U Rackmount Enclosure: 438 x 43 x 718mm (17.25" x 1.7" x 28.25") Package: 752 x 203 x 975mm (29.6" x 8" x 38.4")
- Processor: s; Intel® C621A Chipset; 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM; 2 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm); Intel® X710 Dual port 10GBase-T LAN onboard; 4x 2.5" hot-swap SATA drive bays; 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System); Two 1000W redundant power supplies with PMBus; SATA (6Gbps); 4 slots per node; RAID 0, 1, 5, 10 support. ASPEED AST2600 BMC, 2 USB, VGA. RoT; Form Factor 1U Rackmount Enclosure: 438 x 43 x 718mm (17.25" x 1.7" x 28.25") Package: 752 x 203 x 975mm (29.6" x 8" x 38.4") Processor Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 32C/64T; Up to 48MB Cache per CPU
- System Memory: Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
- Drive Bays Configuration: Default: Total 4 bays 4 front hot-swap 2.5" SATA drive bays
- Expansion Slots: Default 2 PCIe 4.0 x16 LP slots
Technical specifications
| Form Factor | 1U Rackmount Enclosure: 438 x 43 x 718mm (17.25" x 1.7" x 28.25") Package: 752 x 203 x 975mm (29.6" x 8" x 38.4") |
|---|---|
| Processor | s; Intel® C621A Chipset; 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM; 2 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm); Intel® X710 Dual port 10GBase-T LAN onboard; 4x 2.5" hot-swap SATA drive bays; 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System); Two 1000W redundant power supplies with PMBus; SATA (6Gbps); 4 slots per node; RAID 0, 1, 5, 10 support. ASPEED AST2600 BMC, 2 USB, VGA. RoT; Form Factor 1U Rackmount Enclosure: 438 x 43 x 718mm (17.25" x 1.7" x 28.25") Package: 752 x 203 x 975mm (29.6" x 8" x 38.4") Processor Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 32C/64T; Up to 48MB Cache per CPU |
| System Memory | Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM |
| Drive Bays Configuration | Default: Total 4 bays 4 front hot-swap 2.5" SATA drive bays |
| Expansion Slots | Default 2 PCIe 4.0 x16 LP slots |
| On-Board Devices | SATA: SATA (6Gbps) Network Connectivity: 2 RJ45 10GBASE-T with Intel® X710-AT2 BMC: ASPEED AST2600 BMC |
| Input / Output | LAN: 1 RJ45 1 GbE Dedicated BMC LAN port USB: 2 USB 3.0 ports (rear) Video: 1 VGA port |
| System Cooling | Fans: Up to 6x 4cm heavy duty fans with optimal fan speed control Air Shroud: 2 Air Shrouds |
| Power Supply | 1x 1000W Redundant Titanium Level (96%) power supply |
| System BIOS | BIOS Type: AMI 32MB SPI Flash EEPROM |
| Management | SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: 5 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory Fan: Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Dimensions and Weight | Weight: Gross Weight: 48.1 lbs (21.9 kg) Net Weight: 33.5 lbs (15.2 kg) Available Color: Black front & silver body |
| Operating Environment | Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Motherboard | Super X12DPT-PT6 |
| Chassis | CSE-809H-R1K05P3 |
Configuration note
Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.




