Supermicro SYS-122FT-DEO-LCC 1-OU FlexTwin Server
1-OU 2-Node FlexTwin™ with liquid cooling (complete rack and onsite service are required)
Description
Product overview
1-OU 2-Node FlexTwin™ with liquid cooling (complete rack and onsite service are required)
Key capabilities
- Form Factor: 1-OU Rackmount Enclosure: 537 x 48 x 855mm (21.14" x 1.89" x 33.66") Package: 670 x 182 x 1125mm (26.38" x 7.17" x 44.29")
- Processor: s up to 128 P-cores or Intel Xeon 6+ Processors up to 288 E-cores with Liquid Cooling (Up to 90% heat capture); Up to 24 DIMMs supporting up to 6TB 8000MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM; Flexible networking with up to 1 OCP 3.0 compatible AIOM slots; Optional 2 PCIe 5.0 x16 FHHL slot + Optional 1 PCIe 5.0 x16 LP slot; Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots; Form Factor 1-OU Rackmount Enclosure: 537 x 48 x 855mm (21.14" x 1.89" x 33.66") Package: 670 x 182 x 1125mm (26.38" x 7.17" x 44.29") Processor Dual Socket BR (LGA-7529) Intel® Xeon® 6900 Series processors with P-cores and Intel Xeon 6+ processors P-cores: Up to 128C/256T; Up to 504MB Cache per CPU E-cores: Up to 288C/288T; Up to 576MB Cache per CPU
- System Memory: Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM (P-core only) Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM (P-core) Max Memory (1DPC): Up to 3TB 8000MT/s ECC DDR5 RDIMM (E-core)
- Drive Bays Configuration: Option A: Total 2 bays 2 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); optional configuration)
- Expansion Slots: PCI-Express (PCIe) Configuration: Default* 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible) Option A* 2 PCIe 5.0 x16 (in x16) FHHL slots 1 PCIe 5.0 x16 (in x16) LP slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.) M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); Optional Configuration)
Technical specifications
| Form Factor | 1-OU Rackmount Enclosure: 537 x 48 x 855mm (21.14" x 1.89" x 33.66") Package: 670 x 182 x 1125mm (26.38" x 7.17" x 44.29") |
|---|---|
| Processor | s up to 128 P-cores or Intel Xeon 6+ Processors up to 288 E-cores with Liquid Cooling (Up to 90% heat capture); Up to 24 DIMMs supporting up to 6TB 8000MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM; Flexible networking with up to 1 OCP 3.0 compatible AIOM slots; Optional 2 PCIe 5.0 x16 FHHL slot + Optional 1 PCIe 5.0 x16 LP slot; Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots; Form Factor 1-OU Rackmount Enclosure: 537 x 48 x 855mm (21.14" x 1.89" x 33.66") Package: 670 x 182 x 1125mm (26.38" x 7.17" x 44.29") Processor Dual Socket BR (LGA-7529) Intel® Xeon® 6900 Series processors with P-cores and Intel Xeon 6+ processors P-cores: Up to 128C/256T; Up to 504MB Cache per CPU E-cores: Up to 288C/288T; Up to 576MB Cache per CPU |
| System Memory | Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM (P-core only) Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM (P-core) Max Memory (1DPC): Up to 3TB 8000MT/s ECC DDR5 RDIMM (E-core) |
| Drive Bays Configuration | Option A: Total 2 bays 2 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); optional configuration) |
| Expansion Slots | PCI-Express (PCIe) Configuration: Default* 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible) Option A* 2 PCIe 5.0 x16 (in x16) FHHL slots 1 PCIe 5.0 x16 (in x16) LP slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.) M.2: 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); Optional Configuration) |
| On-Board Devices | NVMe: NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) Network Connectivity: Via AIOM |
| Input / Output | LAN: 1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600) USB: 1 USB 3.0 Type-A port (Front) Video: 1 Mini-DP port (Front) |
| System Cooling | Fans: Up to 8 Fan 40mm Fan(s) Air Shroud: 1 Air Shroud Liquid Cooling: Direct to Chip (D2C) Cold Plate |
| Power Supply | Power via Busbar (49-52V DC) |
| System BIOS | BIOS Type: AMI 64MB SPI Flash |
| Management | SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: Monitors for CPU Cores, Chipset Voltages, Memory Fan: Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment |
| Dimensions and Weight | Weight: Gross Weight: 89 lbs (40.37 kg) Net Weight: 58.5 lbs (26.54 kg) Available Color: Silver |
| Operating Environment | RoHS Compliant Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
| Motherboard | Super X14DBT-FLAP2 |
| Chassis | CSE-OC101TS-V01DFP |
Configuration note
Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.
