Supermicro SYS-751GE-TNRT Tower or 5U SuperWorkstation Server
DP rackmount tower 4-GPU workstation with closed-loop liquid cooling
Description
Product overview
DP rackmount tower 4-GPU workstation with closed-loop liquid cooling
Key capabilities
- Form Factor: Tower or 5U Rackmount Enclosure: 454.7 x 218.4 x 701mm (17.9" x 8.6" x 27.6") Package: 388 x 655 x 956mm (15.3" x 25.8" x 37.6")
- Processor: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon®4th Gen Intel® Xeon® Scalable processors Up to 64C/128T; Up to 320MB Cache per CPU GPU Max GPU Count: Up to 4 double-width GPUs Supported GPU: NVIDIA PCIe: A100 CPU-GPU Interconnect: PCIe 4.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: NVIDIA® NVLink™ Bridge (optional)
- System Memory: Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
- Drive Bays Configuration: Default: Total 8 bays 8 front hot-swap 2.5" NVMe/SAS*/SATA drive bays (*SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 NVMe slots (M-key 2280/22110)
- Expansion Slots: Default 6 PCIe 5.0 x16 FHFL slots
Technical specifications
| Form Factor | Tower or 5U Rackmount Enclosure: 454.7 x 218.4 x 701mm (17.9" x 8.6" x 27.6") Package: 388 x 655 x 956mm (15.3" x 25.8" x 37.6") |
|---|---|
| Processor | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon®4th Gen Intel® Xeon® Scalable processors Up to 64C/128T; Up to 320MB Cache per CPU GPU Max GPU Count: Up to 4 double-width GPUs Supported GPU: NVIDIA PCIe: A100 CPU-GPU Interconnect: PCIe 4.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: NVIDIA® NVLink™ Bridge (optional) |
| System Memory | Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM |
| Drive Bays Configuration | Default: Total 8 bays 8 front hot-swap 2.5" NVMe/SAS*/SATA drive bays (*SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 NVMe slots (M-key 2280/22110) |
| Expansion Slots | Default 6 PCIe 5.0 x16 FHFL slots |
| On-Board Devices | SATA: SATA (6Gbps); RAID 0/1/5/10 support Network Connectivity: 2 RJ45 10GbE with Intel® X550-AT2 1 RJ45 1GbE with ASPEED AST2600 1 SFP28 25GbE (optional) |
| Input / Output | LAN: 1 RJ45 1 GbE Dedicated BMC LAN port 2 RJ45 10 GbE LAN ports USB: 2 USB 3.2 Gen1 ports (front) 3 USB 3.2 Gen1 ports (rear) 1 USB 3.2 Gen2 port (rear) Video: 1 VGA port DOM: 2 SATA DOM (Disk on Module) ports Audio: 7.1 HD Audio Line Out DATASHEET More details here Mic in ©2026 Copyright Super Micro Computer, Inc. All rights reserved. |
| System Cooling | Fans: Up to 1 fan 8cm Fan(s) Up to 2 fan 12cm Fan(s) Up to 1 liquid cooling Fan(s) Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 1x 2200W Redundant Titanium Level (96%) power supply |
| System BIOS | BIOS Type: AMI 32MB SPI Flash EEPROM |
| Management | SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: 8+4 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory Fan: Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Dimensions and Weight | Weight: Gross Weight: 121 lbs (55 kg) Net Weight: 97 lbs (44 kg) Available Color: Black Front & Black Body |
| Operating Environment | Operating Temperature: 10°C to 25°C (50°F to 77°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Motherboard | Super X13DEG-QT |
| Chassis | CSE-759TS-R2K21BP |
Configuration note
Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.
