Supermicro SYS-220TP-HC8TR 2U Twin Server

2U 4-node TwinPro with 6 2.5″ SAS/SATA drives per node and dual 10GbE

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Description

Product overview

2U 4-node TwinPro with 6 2.5" SAS/SATA drives per node and dual 10GbE

Key capabilities

  • Form Factor: 2U Rackmount Enclosure: 438 x 88 x 730mm (17.25" x 3.47" x 28.75") Package: 622 x 254 x 1143mm (24.5" x 10" x 45")
  • Processor: s; Intel® C621A Chipset; 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM; 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm); Intel® X710 Dual port 10GBase-T LAN onboard; 6x 2.5" hot-swap SATA/SAS drive bays; 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System); Two 2200W redundant power supplies with PMBus; Broadcom® 3808 SAS (12Gbps); 6 slots per node; HBA only, no RAID support. ASPEED AST2600 BMC, 2 USB, VGA. RoT; Form Factor 2U Rackmount Enclosure: 438 x 88 x 730mm (17.25" x 3.47" x 28.75") Package: 622 x 254 x 1143mm (24.5" x 10" x 45") Processor Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 32C/64T; Up to 48MB Cache per CPU
  • System Memory: Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
  • Drive Bays Configuration: Default: Total 6 bays 6 front hot-swap 2.5" SAS/SATA drive bays
  • Expansion Slots: Default 1 PCIe 4.0 x16 (in x16) LP slot

Technical specifications

Form Factor 2U Rackmount Enclosure: 438 x 88 x 730mm (17.25" x 3.47" x 28.75") Package: 622 x 254 x 1143mm (24.5" x 10" x 45")
Processor s; Intel® C621A Chipset; 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM; 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm); Intel® X710 Dual port 10GBase-T LAN onboard; 6x 2.5" hot-swap SATA/SAS drive bays; 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System); Two 2200W redundant power supplies with PMBus; Broadcom® 3808 SAS (12Gbps); 6 slots per node; HBA only, no RAID support. ASPEED AST2600 BMC, 2 USB, VGA. RoT; Form Factor 2U Rackmount Enclosure: 438 x 88 x 730mm (17.25" x 3.47" x 28.75") Package: 622 x 254 x 1143mm (24.5" x 10" x 45") Processor Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Up to 32C/64T; Up to 48MB Cache per CPU
System Memory Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM
Drive Bays Configuration Default: Total 6 bays 6 front hot-swap 2.5" SAS/SATA drive bays
Expansion Slots Default 1 PCIe 4.0 x16 (in x16) LP slot
On-Board Devices Network Connectivity: 2 RJ45 10GBASE-T with Intel® X710-AT2 BMC: ASPEED AST2600 BMC
Input / Output LAN: 1 RJ45 1 GbE Dedicated BMC LAN port USB: 2 USB 3.0 ports (rear) Video: 1 VGA port
System Cooling Fans: Up to 4x 8cm heavy duty fans with optimal fan speed control Air Shroud: 4 Air Shrouds
Power Supply 1x 2200W Redundant Titanium Level (96%) power supply
System BIOS BIOS Type: AMI 32MB SPI Flash EEPROM
Management SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: 5 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory Fan: Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Dimensions and Weight Weight: Gross Weight: 90 lbs (40.9 kg) Net Weight: 72 lbs (32.7 kg) Available Color: Black front & silver body
Operating Environment Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Motherboard Super X12DPT-PT6
Chassis CSV-217HQ+-R2K20BP4

Configuration note

Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.

Official sources