Supermicro SYS-751A-I Tower or 5U SuperWorkstation Server
DP full rackmount tower workstation for 3D design and content creation
Description
Product overview
DP full rackmount tower workstation for 3D design and content creation
Key capabilities
- Form Factor: Tower or 5U Rackmount Enclosure: 221 x 536 x 574mm (8.7" x 21.1" x 22.6") Package: 371 x 701 x 711mm (14.6" x 27.6" x 28")
- Processor: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon®4th Gen Intel® Xeon® Scalable processors Up to 64C/128T; Up to 320MB Cache per CPU GPU Max GPU Count: Up to 2 double-width GPUs CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: PCIe
- System Memory: Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
- Drive Bays Configuration: Default: Total 4 bays 4 front fixed 3.5" NVMe/SAS*/SATA drive bays Option A: Total 6 bays 4 internal fixed 3.5" NVMe/SATA drive bays 2 front fixed 2.5" SATA drive bays (*SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 NVMe slots (M-key 2280/22110) Peripheral Bays: 2 5.25" bays (optional)
- Expansion Slots: Default 5 PCIe 5.0 x16 FHFL slots 1 PCIe 5.0 x8 FHHL slot
Technical specifications
| Form Factor | Tower or 5U Rackmount Enclosure: 221 x 536 x 574mm (8.7" x 21.1" x 22.6") Package: 371 x 701 x 711mm (14.6" x 27.6" x 28") |
|---|---|
| Processor | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon®4th Gen Intel® Xeon® Scalable processors Up to 64C/128T; Up to 320MB Cache per CPU GPU Max GPU Count: Up to 2 double-width GPUs CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: PCIe |
| System Memory | Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM |
| Drive Bays Configuration | Default: Total 4 bays 4 front fixed 3.5" NVMe/SAS*/SATA drive bays Option A: Total 6 bays 4 internal fixed 3.5" NVMe/SATA drive bays 2 front fixed 2.5" SATA drive bays (*SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 NVMe slots (M-key 2280/22110) Peripheral Bays: 2 5.25" bays (optional) |
| Expansion Slots | Default 5 PCIe 5.0 x16 FHFL slots 1 PCIe 5.0 x8 FHHL slot |
| On-Board Devices | SATA: SATA (6Gbps); RAID 0/1/5/10 support Chipset: Intel® C741 Network Connectivity: 2 RJ45 10GbE |
| Input / Output | LAN: 2 RJ45 10 GbE LAN ports (IPMI shared on LAN port 1) USB: 2 USB 2.0 Type-A ports (front) 2 USB 3.2 Gen1 Type-A ports (front) 1 USB 3.2 Gen2 Type-C port (Front) 1 USB 3.2 Gen2 Type-A port (Header) 4 USB 3.2 Gen1 Type-A ports (Rear) DATASHEET More details here Video: 1 VGA port DOM: 2 SATA DOM (Disk on Module) ports Audio: 7.1 HD Audio Line Out Mic in ©2026 Copyright Super Micro Computer, Inc. All rights reserved. |
| System Cooling | Fans: Up to 3x 12cm Fan(s) |
| Power Supply | 1x 2000W Platinum Level (92%) power supply |
| System BIOS | BIOS Type: AMI 32MB SPI FLASH ROM |
| Management | SuperCloud Composer® (SCC); Supermicro Server Manager (SSM); Supermicro Update Manager (SUM); Supermicro SuperDoctor® 5 (SD5); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New! PC Health Monitoring CPU: Monitors for CPU Cores, Chipset Voltages, Memory. Fan: Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Dimensions and Weight | Weight: Gross Weight: 59.5 lbs (27 kg) Net Weight: 56.2 lbs (25.5 kg) Available Color: Black |
| Operating Environment | Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Motherboard | Super X13DAI-T |
| Chassis | CSE-GS7A-000NBP3 |
Configuration note
Processor, memory, storage, networking, accelerator, power, cooling and regional order codes may vary by configuration. GPULoom confirms the exact bill of materials and compatibility for each inquiry.




